It offers Board Connectors, Flex Connectors and LGA Connectors for communication systems like Radar systems, Rugged Laptops, Hand Held systems and Antenna systems.
Ardent connectors offer products for industrial applications such as: Logic Analyzers, Networking Equipment, Final Package Test Equipment, and Wafer Probe Test Equipment.
For Military/ Aerospace applications Ardent offers connector products for Hand Held Radios, UAV Systems, Radar and Satellite connectors, Weapons systems, Missile Components, and Monitoring Equipment.
Ardent's all metal contact technology offers electrical invisibility with a measured self inductance of .5nH exhibiting an insertion loss of -1db through 37GHz and a -3db through 40GHz. Ardent contacts have low contact resistance by using a low surface area contact patch, which allows design of high density connectors without high levels of contact force. RC Springprobe™ technology accommodates a variety of applications in area array and peripherally leaded connector designs. The contact can achieve pitch as small as .3mm on a variety of devices. RC Springprobe™ technology is ideal for BGA Sockets, LGA Connectors, Board Connectors and RF Test Sockets for various package types including QFN packages, BGA/LGA large area array packages, and other chip scale, flip chip, substrate and packaged ICs.
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